Bumili SSTUB32865ET/G,518 sa BYCHPS
Bumili na may garantiya
SSTUB32865ET/G,518
- Numero ng Bahagi:
- SSTUB32865ET/G,518
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- IC REG BUFFER 28BIT 160TFBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18763 Pieces
- Data sheet:
- SSTUB32865ET/G,518.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SSTUB32865ET/G,518, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SSTUB32865ET/G,518 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Supply Boltahe: | 1.7 V ~ 2 V |
|---|---|
| Supplier aparato Package: | 160-TFBGA (9x13) |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 160-TFBGA |
| Ibang pangalan: | 568-3542-2 935281691518 SSTUB32865ET/G-T |
| operating Temperature: | 0°C ~ 70°C |
| Bilang ng mga Bits: | 28 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Bilang Bahagi: | SSTUB32865ET/G,518 |
| logic Type: | 1:2 Registered Buffer with Parity |
| Ang pinalawak Paglalarawan: | 1:2 Registered Buffer with Parity IC 160-TFBGA (9x13) |
| paglalarawan: | IC REG BUFFER 28BIT 160TFBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SSTUB32865ET/G,518
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
SSTUB32864EC/G,518 | NXP USA Inc. | IC REG BUFFER 25BIT 96-LFBGA | Pagtatanong |
|
SSTUB32866EC/G,518 | NXP USA Inc. | IC REG BUFFER 25BIT 96-LFBGA | Pagtatanong |
 |
SSTUB32868ET/S,518 | NXP USA Inc. | IC REG BUFFER CONFIG 176TFBGA | Pagtatanong |
|
SSTUB32868ET/G,518 | NXP USA Inc. | IC REG BUFFER CONFIG 176TFBGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers