Bumili SVC276-TL-E sa BYCHPS
Bumili na may garantiya
SVC276-TL-E
- Numero ng Bahagi:
- SVC276-TL-E
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Paglalarawan:
- DIODE FM VARICAP TWIN VR 8V MCP3
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12040 Pieces
- Data sheet:
- SVC276-TL-E.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SVC276-TL-E, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SVC276-TL-E sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Peak Reverse (Max): | 16V |
|---|---|
| Supplier aparato Package: | 3-MCPH |
| serye: | - |
| Q @ Vr, F: | 100 @ 2V, 100MHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | SC-70, SOT-323 |
| operating Temperature: | 125°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 7 Weeks |
| Manufacturer Bilang Bahagi: | SVC276-TL-E |
| Ang pinalawak Paglalarawan: | Varactor 1 Pair Common Cathode 16V Surface Mount 3-MCPH |
| Type diode: | 1 Pair Common Cathode |
| paglalarawan: | DIODE FM VARICAP TWIN VR 8V MCP3 |
| Kapasidad Ratio Kondisyon: | C2/C8 |
| kapasidad Ratio: | 3.1 |
| Kapasidad @ Vr, F: | 23.78pF @ 8V, 1MHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SVC276-TL-E
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
SVC270-TL-E | ON Semiconductor | DIODE FM VARICAP TWIN VR 8V MCP3 | Pagtatanong |
 |
ZC831ATA | Diodes Incorporated | DIODE VAR CAP 15PF 25V SOT23-3 | Pagtatanong |
 |
BB535E7908HTSA1 | Infineon Technologies | DIODE VARACTOR 30V SOD-323 | Pagtatanong |
|
SVC272-TL-E | ON Semiconductor | DIODE FM VARICAP TWIN VR 8V MCP3 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers