Bumili T513X336K035BH61107505 sa BYCHPS
Bumili na may garantiya
T513X336K035BH61107505
- Numero ng Bahagi:
- T513X336K035BH61107505
- Manufacturer:
- KEMET
- Paglalarawan:
- CAP TANT 33UF 35V 10% 2917
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 17152 Pieces
- Data sheet:
- T513X336K035BH61107505.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa T513X336K035BH61107505, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa T513X336K035BH61107505 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 35V |
|---|---|
| uri: | Molded |
| pagpapaubaya: | ±10% |
| Sukat / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| serye: | T513 |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 2917 (7343 Metric) |
| Ibang pangalan: | 399-10465-2 T513X336K035BH6110 T513X336K035GH6110 |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Size Code: | X |
| Manufacturer Bilang Bahagi: | T513X336K035BH61107505 |
| Lifetime @ Temp.: | 2000 Hrs @ 85°C |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | 0.169" (4.30mm) |
| Mga tampok: | COTS (High Reliability) |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 33µF ±10% Molded Tantalum Capacitors 35V 2917 (7343 Metric) 65 mOhm |
| ESR (Katumbas Series pagtutol): | 65 mOhm |
| paglalarawan: | CAP TANT 33UF 35V 10% 2917 |
| kapasidad: | 33µF |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa T513X336K035BH61107505
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers