Bumili T92P7D24-24 sa BYCHPS
Bumili na may garantiya
T92P7D24-24
- Numero ng Bahagi:
- T92P7D24-24
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GEN PURPOSE DPST 30A 24V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14888 Pieces
- Data sheet:
- T92P7D24-24.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa T92P7D24-24, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa T92P7D24-24 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 18 VDC |
|---|---|
| I-off ang Boltahe (Min): | 2.4 VDC |
| pagwawakas Style: | Quick Connect - 0.250" (6.3mm) |
| Paglipat Boltahe: | 277VAC, 28VDC - Max |
| serye: | T92 |
| release Time: | 15ms |
| Type relay: | General Purpose |
| packaging: | Bulk |
| Ibang pangalan: | 1423008-9 PB1858 T92P7D24-24-ND |
| operating Temperature: | -55°C ~ 85°C |
| Magpapatakbo Time: | 15ms |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | T92P7D24-24 |
| Mga tampok: | Insulation - Class F |
| Ang pinalawak Paglalarawan: | General Purpose Relay DPST (2 Form A) 24VDC Coil Chassis Mount |
| paglalarawan: | RELAY GEN PURPOSE DPST 30A 24V |
| Contact Rating (Kasalukuyang): | 30A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | DPST (2 Form A) |
| Coil Boltahe: | 24VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 350 Ohms |
| Coil Power: | 1.7 W |
| Coil Kasalukuyang: | 70.8mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa T92P7D24-24
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers