Bumili TDC334K050NSE-F sa BYCHPS
Bumili na may garantiya
TDC334K050NSE-F
- Numero ng Bahagi:
- TDC334K050NSE-F
- Manufacturer:
- Cornell Dubilier Electronics
- Paglalarawan:
- CAP TANT 0.33UF 50V 10% RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12235 Pieces
- Data sheet:
- TDC334K050NSE-F.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa TDC334K050NSE-F, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa TDC334K050NSE-F sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 50V |
|---|---|
| uri: | Conformal Coated |
| pagpapaubaya: | ±10% |
| Sukat / Dimension: | 0.175" Dia (4.45mm) |
| serye: | TDC |
| packaging: | Bulk |
| Package / Kaso: | Radial |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Size Code: | E |
| Manufacturer Bilang Bahagi: | TDC334K050NSE-F |
| Lifetime @ Temp.: | - |
| Lead Spacing: | 0.125" (3.18mm) |
| Taas - Makaupo (Max): | 0.350" (8.89mm) |
| Mga tampok: | General Purpose |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 0.33µF ±10% Conformal Coated Tantalum Capacitors 50V Radial |
| ESR (Katumbas Series pagtutol): | - |
| paglalarawan: | CAP TANT 0.33UF 50V 10% RADIAL |
| kapasidad: | 0.33µF |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa TDC334K050NSE-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers