Bumili TSC-124D3H,000 sa BYCHPS
Bumili na may garantiya
TSC-124D3H,000
- Numero ng Bahagi:
- TSC-124D3H,000
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY TELECOM SPDT 1A 24V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13272 Pieces
- Data sheet:
- 1.TSC-124D3H,000.pdf2.TSC-124D3H,000.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa TSC-124D3H,000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa TSC-124D3H,000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 18 VDC |
|---|---|
| I-off ang Boltahe (Min): | 1.2 VDC |
| pagwawakas Style: | PC Pin |
| Paglipat Boltahe: | 120VAC, 30VDC - Max |
| serye: | TSC, OEG |
| release Time: | 5ms |
| Type relay: | Telecom |
| packaging: | Tube |
| Ibang pangalan: | 5-1440007-3 TSC-124D3H 000 TSC-124D3H,000-ND TSC124D3H,000 TSC124D3H000 |
| operating Temperature: | -30°C ~ 80°C |
| Magpapatakbo Time: | 5ms |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | TSC-124D3H,000 |
| Mga tampok: | Sealed - Fully |
| Ang pinalawak Paglalarawan: | Telecom Relay SPDT (1 Form C) Through Hole |
| paglalarawan: | RELAY TELECOM SPDT 1A 24V |
| Contact Rating (Kasalukuyang): | 1A |
| Contact Material: | Silver Nickel (AgNi) |
| Contact Form: | SPDT (1 Form C) |
| Coil Boltahe: | 24VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 1.92 kOhms |
| Coil Power: | 300 mW |
| Coil Kasalukuyang: | 12.5mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa TSC-124D3H,000
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers