Bumili U3761MB-XFNG3G sa BYCHPS
Bumili na may garantiya
U3761MB-XFNG3G
- Numero ng Bahagi:
- U3761MB-XFNG3G
- Manufacturer:
- Micrel / Microchip Technology
- Paglalarawan:
- IC UNVRSL PHONE CIRCUIT 44SSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16176 Pieces
- Data sheet:
- U3761MB-XFNG3G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa U3761MB-XFNG3G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa U3761MB-XFNG3G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | - |
|---|---|
| Supplier aparato Package: | 44-SSO |
| serye: | - |
| Power (Watts): | 900mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 44-SOP (0.291", 7.40mm Width) |
| operating Temperature: | -25°C ~ 75°C |
| Bilang ng Circuits: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | U3761MB-XFNG3G |
| interface: | - |
| May kasamang: | Ceramic Resonator, Loop Interrupt Detection, MUTE, Notice Function, Optical Indication, Pause Function, Receiving Amplifier |
| tungkulin: | Universal Telephone Circuit |
| Ang pinalawak Paglalarawan: | Telecom IC Universal Telephone Circuit 44-SSO |
| paglalarawan: | IC UNVRSL PHONE CIRCUIT 44SSOP |
| Current - Supply: | 3.8mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa U3761MB-XFNG3G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog