Bumili UF1717V-300Y1R2-03 sa BYCHPS
Bumili na may garantiya
UF1717V-300Y1R2-03
- Numero ng Bahagi:
- UF1717V-300Y1R2-03
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- CMC 30UH 1.2A 2LN TH
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12556 Pieces
- Data sheet:
- UF1717V-300Y1R2-03.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa UF1717V-300Y1R2-03, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa UF1717V-300Y1R2-03 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe Rating - DC: | - |
|---|---|
| Boltahe Rating - AC: | - |
| Sukat / Dimension: | 0.689" L x 0.433" W (17.50mm x 11.00mm) |
| serye: | UF |
| Ratings: | - |
| packaging: | Bulk |
| Package / Kaso: | Vertical, 4 PC Pin |
| Ibang pangalan: | UF1717V-300Y1R203 |
| operating Temperature: | -20°C ~ 120°C |
| Bilang ng mga linya: | 2 |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | UF1717V-300Y1R2-03 |
| Inductance @ Frequency: | 30µH @ 1kHz |
| Impedance @ Frequency: | - |
| Taas (Max): | 0.669" (17.00mm) |
| Uri ng Filter: | Power Line |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 30µH @ 1kHz 2 Line Common Mode Choke Through Hole 1.2A DCR 150 mOhm |
| paglalarawan: | CMC 30UH 1.2A 2LN TH |
| DC pagtutol (DCR) (Max): | 150 mOhm |
| Card Kapal (mm): | 1.2A |
| Mga Pag-apruba: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa UF1717V-300Y1R2-03
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers