Bumili UPD60510F1-HN4-M1-A sa BYCHPS
Bumili na may garantiya
UPD60510F1-HN4-M1-A
- Numero ng Bahagi:
- UPD60510F1-HN4-M1-A
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IC MCU 32BIT ROMLESS 324FBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17509 Pieces
- Data sheet:
- UPD60510F1-HN4-M1-A.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa UPD60510F1-HN4-M1-A, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa UPD60510F1-HN4-M1-A sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 0.9 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 324-FBGA (19x19) |
| bilis: | 100MHz |
| serye: | R-IN32M3 |
| RAM Size: | 512K x 8 |
| Type Program Memory: | ROMless |
| Size Program Memory: | - |
| Peripherals: | DMA, WDT |
| packaging: | Tray |
| Package / Kaso: | 324-BGA |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 96 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | UPD60510F1-HN4-M1-A |
| Ang pinalawak Paglalarawan: | ARM® Cortex®-M3 R-IN32M3 Microcontroller IC 32-Bit 100MHz ROMless 324-FBGA (19x19) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 32BIT ROMLESS 324FBGA |
| data Converters: | - |
| core Size: | 32-Bit |
| core Processor: | ARM® Cortex®-M3 |
| Connectivity: | CAN, CSI, Ethernet, I²C, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa UPD60510F1-HN4-M1-A
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers