Bumili UPD70F3454F1(R)-DA9-A sa BYCHPS
Bumili na may garantiya
UPD70F3454F1(R)-DA9-A
- Numero ng Bahagi:
- UPD70F3454F1(R)-DA9-A
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IC MCU 32BIT 256KB FLASH 161BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19854 Pieces
- Data sheet:
- UPD70F3454F1(R)-DA9-A.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa UPD70F3454F1(R)-DA9-A, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa UPD70F3454F1(R)-DA9-A sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 3.5 V ~ 5.5 V |
|---|---|
| bilis: | 64MHz |
| serye: | V850E/Ix3 |
| RAM Size: | 12K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 256KB (256K x 8) |
| Peripherals: | DMA, LVD, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 161-LFBGA |
| Ibang pangalan: | UPD70F3454F1-DA9-A |
| Type osileytor: | External |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 64 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 24 Weeks |
| Manufacturer Bilang Bahagi: | UPD70F3454F1(R)-DA9-A |
| Ang pinalawak Paglalarawan: | V850ES V850E/Ix3 Microcontroller IC 32-Bit 64MHz 256KB (256K x 8) FLASH |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 32BIT 256KB FLASH 161BGA |
| data Converters: | A/D 10x12b, 8x10b |
| core Size: | 32-Bit |
| core Processor: | V850ES |
| Connectivity: | CSI, EBI/EMI, I²C, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa UPD70F3454F1(R)-DA9-A
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog