Bumili UPD70F3523GJA-GAE-G sa BYCHPS
Bumili na may garantiya
UPD70F3523GJA-GAE-G
- Numero ng Bahagi:
- UPD70F3523GJA-GAE-G
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15930 Pieces
- Data sheet:
- UPD70F3523GJA-GAE-G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa UPD70F3523GJA-GAE-G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa UPD70F3523GJA-GAE-G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 2.7 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 144-LQFP (20x20) |
| bilis: | 80MHz |
| serye: | V850E2/Dx4 |
| RAM Size: | 48K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 512KB (512K x 8) |
| Peripherals: | DMA, LCD, LVD, POR, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 144-LQFP |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 105 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 24 Weeks |
| Manufacturer Bilang Bahagi: | UPD70F3523GJA-GAE-G |
| Ang pinalawak Paglalarawan: | V850E2M V850E2/Dx4 Microcontroller IC 32-Bit 80MHz 512KB (512K x 8) FLASH 144-LQFP (20x20) |
| EEPROM Size: | 32K x 8 |
| paglalarawan: | IC MCU 32BIT 512KB FLASH 144LQFP |
| data Converters: | A/D 16x10b, A/D 16x12b |
| core Size: | 32-Bit |
| core Processor: | V850E2M |
| Connectivity: | CAN, CSI, I²C, LIN, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa UPD70F3523GJA-GAE-G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog