Bumili UPD70F3770GC-UEU-AX sa BYCHPS
Bumili na may garantiya
UPD70F3770GC-UEU-AX
- Numero ng Bahagi:
- UPD70F3770GC-UEU-AX
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16752 Pieces
- Data sheet:
- UPD70F3770GC-UEU-AX.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa UPD70F3770GC-UEU-AX, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa UPD70F3770GC-UEU-AX sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 2.85 V ~ 3.6 V |
|---|---|
| bilis: | 48MHz |
| serye: | V850ES/Jx3-H |
| RAM Size: | 40K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 256KB (256K x 8) |
| Peripherals: | DMA, LVD, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 100-LQFP |
| Ibang pangalan: | 972-1022 UPD70F3770GC-UEU-AX-ND |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 77 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 24 Weeks |
| Manufacturer Bilang Bahagi: | UPD70F3770GC-UEU-AX |
| Ang pinalawak Paglalarawan: | V850ES V850ES/Jx3-H Microcontroller IC 32-Bit 48MHz 256KB (256K x 8) FLASH |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 32BIT 256KB FLASH 100LQFP |
| data Converters: | A/D 12x10b; D/A 2x8b |
| core Size: | 32-Bit |
| core Processor: | V850ES |
| Connectivity: | CAN, CSI, EBI/EMI, I²C, UART/USART, USB |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa UPD70F3770GC-UEU-AX
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog