Bumili V23061B1005A601 sa BYCHPS
Bumili na may garantiya
V23061B1005A601
- Numero ng Bahagi:
- V23061B1005A601
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GEN PURPOSE SPDT 8A 12V
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS compliant
- Magagamit na Dami:
- 18725 Pieces
- Data sheet:
- V23061B1005A601.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa V23061B1005A601, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa V23061B1005A601 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 8.2 VDC |
|---|---|
| I-off ang Boltahe (Min): | 1.2 VDC |
| pagwawakas Style: | PC Pin |
| Paglipat Boltahe: | 400VAC - Max |
| serye: | MSR, SCHRACK |
| release Time: | 5ms |
| Type relay: | General Purpose |
| packaging: | Tube |
| Ibang pangalan: | 9-1393222-9 9-1393222-9-ND 913932229 PB1754 V23061B1005A601-ND |
| operating Temperature: | -40°C ~ 85°C |
| Magpapatakbo Time: | 10ms |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | V23061B1005A601 |
| Mga tampok: | Insulation - Class A, Sealed - Fully |
| Ang pinalawak Paglalarawan: | General Purpose Relay SPDT (1 Form C) 12VDC Coil Through Hole |
| paglalarawan: | RELAY GEN PURPOSE SPDT 8A 12V |
| Contact Rating (Kasalukuyang): | 8A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | SPDT (1 Form C) |
| Coil Boltahe: | 12VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 652 Ohms |
| Coil Power: | 221 mW |
| Coil Kasalukuyang: | 18.4mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa V23061B1005A601
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers