Bumili WRM483245-15F5-5V-G1 sa BYCHPS
Bumili na may garantiya
WRM483245-15F5-5V-G1
- Numero ng Bahagi:
- WRM483245-15F5-5V-G1
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- RX 1 COIL 1 LAYER 13UH
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19370 Pieces
- Data sheet:
- WRM483245-15F5-5V-G1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa WRM483245-15F5-5V-G1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa WRM483245-15F5-5V-G1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | 1 Coil, 1 Layer |
|---|---|
| pagpapaubaya: | - |
| serye: | WRM |
| Q @ Freq: | - |
| Ibang pangalan: | 445-173096 |
| operating Temperature: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | WRM483245-15F5-5V-G1 |
| inductance: | 13µH |
| tungkulin: | Receiver |
| Frequency - Self Resonant: | - |
| Ang pinalawak Paglalarawan: | 1 Coil, 1 Layer 13µH Wireless Charging Coil Receiver 270 mOhm Max |
| paglalarawan: | RX 1 COIL 1 LAYER 13UH |
| DC pagtutol (DCR): | 270 mOhm Max |
| kasalukuyang Rating: | - |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa WRM483245-15F5-5V-G1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
WRM483245-15F5-5V-G2 | TDK Corporation | RX 1 COIL 1 LAYER 13UH | Pagtatanong |
 |
WRM483245-15F5-5V-G | TDK Corporation | RX 1 COIL 1 LAYER 13UH | Pagtatanong |
 |
IWAS3827ECEB100J50 | Vishay Dale | RX 1 COIL 1 LAYER 10.7UH | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers