Bumili WT303012-12F2-ID sa BYCHPS
Bumili na may garantiya
WT303012-12F2-ID
- Numero ng Bahagi:
- WT303012-12F2-ID
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- TX 1 COIL 1 LAYER 6.3UH
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 20075 Pieces
- Data sheet:
- WT303012-12F2-ID.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa WT303012-12F2-ID, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa WT303012-12F2-ID sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | 1 Coil, 1 Layer |
|---|---|
| pagpapaubaya: | ±5% |
| Sukat / Dimension: | 1.181" Dia x 0.078" H (30.00mm x 1.99mm) |
| serye: | WT |
| Q @ Freq: | - |
| Ibang pangalan: | 445-174582 TXDF11161TWN6505 |
| operating Temperature: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | WT303012-12F2-ID |
| inductance: | 6.3µH |
| tungkulin: | Transmitter |
| Frequency - Self Resonant: | - |
| Ang pinalawak Paglalarawan: | 1 Coil, 1 Layer 6.3µH Wireless Charging Coil Transmitter 90 mOhm |
| paglalarawan: | TX 1 COIL 1 LAYER 6.3UH |
| DC pagtutol (DCR): | 90 mOhm |
| kasalukuyang Rating: | - |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa WT303012-12F2-ID
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
760308103205 | Wurth Electronics Inc. | RX 1 COIL 1 LAYER 11UH 2.5A | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers