Bumili XC7Z035-1FFG900C sa BYCHPS
Bumili na may garantiya
XC7Z035-1FFG900C
- Numero ng Bahagi:
- XC7Z035-1FFG900C
- Manufacturer:
- Xilinx
- Paglalarawan:
- IC SOC CORTEX-A9 KINTEX7 900BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12470 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa XC7Z035-1FFG900C, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa XC7Z035-1FFG900C sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Supplier aparato Package: | 900-FCBGA (31x31) |
|---|---|
| bilis: | 667MHz |
| serye: | Zynq®-7000 |
| pangunahing Katangian: | Kintex™-7 FPGA, 275K Logic Cells |
| Peripherals: | DMA |
| packaging: | Tray |
| Package / Kaso: | 900-BBGA, FCBGA |
| operating Temperature: | 0°C ~ 85°C (TJ) |
| Bilang ng I / O: | 130 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 6 Weeks |
| Manufacturer Bilang Bahagi: | XC7Z035-1FFG900C |
| MCU RAM: | 256KB |
| MCU Flash: | - |
| Ang pinalawak Paglalarawan: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 667MHz 900-FCBGA (31x31) |
| paglalarawan: | IC SOC CORTEX-A9 KINTEX7 900BGA |
| core Processor: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Connectivity: | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| arkitektura: | MCU, FPGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa XC7Z035-1FFG900C
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers