Bumili XQ7K325T-1RF676M sa BYCHPS
Bumili na may garantiya
XQ7K325T-1RF676M
- Numero ng Bahagi:
- XQ7K325T-1RF676M
- Manufacturer:
- Xilinx
- Paglalarawan:
- IC FPGA KINTEX-7 676-FBGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 18099 Pieces
- Data sheet:
- XQ7K325T-1RF676M.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa XQ7K325T-1RF676M, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa XQ7K325T-1RF676M sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 0.87 V ~ 0.93 V |
|---|---|
| Kabuuang RAM Bits: | 16404480 |
| Supplier aparato Package: | 676-FCBGA (27x27) |
| serye: | Kintex®-7Q |
| Package / Kaso: | 676-BBGA, FCBGA |
| operating Temperature: | -55°C ~ 125°C (TJ) |
| Bilang ng Logic Elements / Cells: | 326080 |
| Bilang ng mga Labs / CLBs: | 25475 |
| Bilang ng I / O: | 400 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | XQ7K325T-1RF676M |
| paglalarawan: | IC FPGA KINTEX-7 676-FBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa XQ7K325T-1RF676M
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
XQ7K325T-1RF676I | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Pagtatanong |
|
XQ7K325T-2RF676I | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Pagtatanong |
|
XQ7K325T-1RF900I | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Pagtatanong |
|
XQ7K325T-2RF900I | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Pagtatanong |
|
XQ7K325T-L2RF676E | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Pagtatanong |
|
XQ7K325T-L2RF900E | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Pagtatanong |
|
XQ7K325T-1RF900M | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers