Bumili XVM-16R2656-R sa BYCHPS
Bumili na may garantiya
XVM-16R2656-R
- Numero ng Bahagi:
- XVM-16R2656-R
- Manufacturer:
- Bussmann (Eaton)
- Paglalarawan:
- CAP 65F 0% +20% 16.2V CHAS MNT
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16400 Pieces
- Data sheet:
- XVM-16R2656-R.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa XVM-16R2656-R, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa XVM-16R2656-R sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 16.2V |
|---|---|
| pagpapaubaya: | 0%, +20% |
| pagwawakas: | Screw Terminals |
| Sukat / Dimension: | 9.291" L x 1.803" W (236.00mm x 45.80mm) |
| serye: | PowerStor XVM |
| packaging: | Bulk |
| Package / Kaso: | Module |
| Ibang pangalan: | 283-4464 |
| operating Temperature: | -40°C ~ 65°C |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 19 Weeks |
| Manufacturer Bilang Bahagi: | XVM-16R2656-R |
| Lifetime @ Temp.: | 1500 Hrs @ 65°C |
| Lead Spacing: | 0.846" (21.50mm) |
| Taas - Makaupo (Max): | 3.051" (77.50mm) |
| Ang pinalawak Paglalarawan: | 65F 0%, +20%(EDLC) Supercapacitor 16.2V Module 22 mOhm 1500 Hrs @ 65°C |
| ESR (Katumbas Series pagtutol): | 22 mOhm |
| paglalarawan: | CAP 65F 0% +20% 16.2V CHAS MNT |
| kapasidad: | 65F |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa XVM-16R2656-R
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
MAL219691154E3 | Vishay BC Components | CAP ALUM 4F 5.6V SMD | Pagtatanong |
 |
JJD0E108MSED | Nichicon | CAP 1000F 20% 2.5V CHASSIS MOUNT | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers