Bumili DS34T108GN+ sa BYCHPS
Bumili na may garantiya
DS34T108GN+
- Numero ng Bahagi:
- DS34T108GN+
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC TDM OVER PACKET 484HSBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14406 Pieces
- Data sheet:
- DS34T108GN+.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DS34T108GN+, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DS34T108GN+ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | TDM (Time Division Multiplexing) |
|---|---|
| Supplier aparato Package: | 484-HSBGA (23x23) |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 484-BGA Exposed Pad |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | DS34T108GN+ |
| Ang pinalawak Paglalarawan: | TDM (Time Division Multiplexing) IC Data Transport 484-HSBGA (23x23) |
| paglalarawan: | IC TDM OVER PACKET 484HSBGA |
| aplikasyon: | Data Transport |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DS34T108GN+
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
DS34T102GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
 |
DS34T104GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Pagtatanong |
|
DS34T101GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
|
DS34T108GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
|
DS34T102GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Pagtatanong |
|
DS34T104GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
|
DS34T101GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog