Bumili DS34T108GN sa BYCHPS
Bumili na may garantiya
DS34T108GN
- Numero ng Bahagi:
- DS34T108GN
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC TDM/PACKET CHIP 484-BGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 14865 Pieces
- Data sheet:
- DS34T108GN.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DS34T108GN, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DS34T108GN sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | TDM (Time Division Multiplexing) |
|---|---|
| Supplier aparato Package: | 484-HSBGA (23x23) |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 484-BGA Exposed Pad |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | DS34T108GN |
| Ang pinalawak Paglalarawan: | TDM (Time Division Multiplexing) IC Data Transport 484-HSBGA (23x23) |
| paglalarawan: | IC TDM/PACKET CHIP 484-BGA |
| aplikasyon: | Data Transport |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DS34T108GN
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
DS34T101GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
 |
DS34T108GN+ | Maxim Integrated | IC TDM OVER PACKET 484HSBGA | Pagtatanong |
|
DS34T102GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Pagtatanong |
|
DS34T104GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Pagtatanong |
|
DS34T102GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
|
DS34T101GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Pagtatanong |
|
DS34T104GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers