Bumili KRCBC130714B sa BYCHPS
Bumili na may garantiya
KRCBC130714B
- Numero ng Bahagi:
- KRCBC130714B
- Manufacturer:
- Panasonic
- Paglalarawan:
- FERRITE CORE 80 OHM HINGED 6.5MM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16475 Pieces
- Data sheet:
- KRCBC130714B.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa KRCBC130714B, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa KRCBC130714B sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Round |
|---|---|
| serye: | KRCB |
| Ratings: | - |
| Outer Dimensyon: | 0.748" W x 0.610" H (19.00mm x 15.50mm) |
| Ibang pangalan: | P11393 |
| Salalayan Type: | Free Hanging |
| materyal: | - |
| Manufacturer Bilang Bahagi: | KRCBC130714B |
| Haba: | 0.827" (21.00mm) |
| Inner Dimensyon: | 0.256" Dia (6.50mm) |
| Impedance @ Frequency: | 80 Ohm @ 100MHz |
| Ang pinalawak Paglalarawan: | Hinged (Snap On) Free Hanging Ferrite Core 80 Ohm @ 100MHz ID 0.256" Dia (6.50mm) OD 0.748" W x 0.610" H (19.00mm x 15.50mm) Length 0.827" (21.00mm) |
| disenyo: | Hinged (Snap On) |
| paglalarawan: | FERRITE CORE 80 OHM HINGED 6.5MM |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa KRCBC130714B
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
KRCBC160928B | Panasonic - DTG | FERRITE CORE 140 OHM HINGED | Pagtatanong |
 |
ZCAT12VN2-BK | TDK Corporation | FERRITE CORE 140 OHM HINGED | Pagtatanong |
 |
28R2240-130 | Laird-Signal Integrity Products | FERRITE CORE 110 OHM SOLID | Pagtatanong |
 |
KRCBC261329B | Panasonic - DTG | FERRITE CORE 170 OHM HINGED | Pagtatanong |
|
28B1122-300 | Laird-Signal Integrity Products | FERRITE CORE 210 OHM SOLID | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers