Bumili T77V1D3-12 sa BYCHPS
Bumili na may garantiya
T77V1D3-12
- Numero ng Bahagi:
- T77V1D3-12
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GEN PURPOSE SPST 3A 12V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19107 Pieces
- Data sheet:
- 1.T77V1D3-12.pdf2.T77V1D3-12.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa T77V1D3-12, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa T77V1D3-12 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 9 VDC |
|---|---|
| I-off ang Boltahe (Min): | 0.6 VDC |
| pagwawakas Style: | PC Pin |
| Paglipat Boltahe: | 250VAC, 30VDC - Max |
| serye: | T77 |
| release Time: | 4ms |
| Type relay: | General Purpose |
| packaging: | Bulk |
| Ibang pangalan: | 2-1393194-6 T77V1D312 |
| operating Temperature: | -30°C ~ 105°C |
| Magpapatakbo Time: | 10ms |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | T77V1D3-12 |
| Mga tampok: | Insulation - Class F, Sealed - Flux Protection |
| Ang pinalawak Paglalarawan: | General Purpose Relay SPST-NO (1 Form A) 12VDC Coil Through Hole |
| paglalarawan: | RELAY GEN PURPOSE SPST 3A 12V |
| Contact Rating (Kasalukuyang): | 3A |
| Contact Material: | Silver (Ag) |
| Contact Form: | SPST-NO (1 Form A) |
| Coil Boltahe: | 12VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 720 Ohms |
| Coil Power: | 200 mW |
| Coil Kasalukuyang: | 16.7mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa T77V1D3-12
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers